ELECTROGRIP CHUCK CAPABILITIES

• Chuck and process development, to guarantee performance:
  • Etch process simulation with rf power and process gases in test chambers
  • SEM imaging, EDX analysis, and Scanning Profilometry to check microstructure integrity
  • Surface particle measurement to assure low particle counts
• Design and manufacture of chucks to suit customer process needs, including:
  • Ultra-High Vacuum to atmospheric air operation
  • Deep cryogenic to almost red-hot temperatures
    • -75 deg. C to +600 deg. C ***NEW LOW LIMIT***
  • Mechanical, radio-frequency, and chemical attack
  • Control of particle contamination, both on substrate front and rear surfaces
• Chuck designs vary over a wide range to accommodate customer needs:
  • Chuck construction materials; polymers, ceramics, glasses, crystals
  • Chuck construction methods; bonding, thermal spray, PVD, plasma processes
  • Substrate types; semiconductor wafer, glass (non conductive), LCD panels, crystals, ...
• Applications:
  • Inspection systems
  • Ion implanters
  • Lithography tools
  • Robot handlers
  • Etch systems
  • PVD systems
  • PECVD systems
  • High Density Plasma systems, ...
• Electrogrip-standard systems available with shorter lead times.