The CP series permits the chuck puck to be removed and replaced

... without breaking liquid thermal transfer fluid lines.

The puck mounts with metal-to-metal contact to the service base,

yielding high thermal conduction to the puck.

 

CP assembly with 200mm chuck puck on 200mm service base;

wafer lift motor drive at bottom. Guard ring removed for clarity ...

A similar CP200 chuck assembly, with guard ring

CP200 series pucks for differing wafer sizes ...

The ceramic composition controls chuck surface appearance.