ELECTROGRIP CP SERIES CHUCKS

The Electrogrip 'Chuck Puck' (CP) series comprises standard electrostatic chuck components that allow fast turnaround for new chuck applications. Since most of the components are in stock at Electrogrip, usually the only item to be made is the CP top layer, to customer specifications.

• Three basic sizes are stocked:
  • CP125 for 50-125mm wafers
  • CP200 for 50-200mm wafers
  • CP300 for 150-300mm wafers
• All CP series pucks can accept square, unflatted, flatted, or specially shaped substrates.
• All CP series pucks can grip insulating substrates, with special electrode designs.
• Surface types include polymer, alumina, sapphire, quartz, glasses -- application dependent.
• The CP series components yield high-performance results:
  • Rf-isolated chuck and service base with grounded guard plate and guard ring
  • Service base includes coolant channels, sealed against vacuum
  • Uniform rf and heat conduction through chuck to substrate
  • Easily removable chuck puck, no breaking of coolant lines or electric connections
  • All services (Lift, Electric, He backfill, Coolant, Rf, T sensor) attach to service base
  • Highly reliable chuck contact system
  • Clean vacuum construction with no attachment bolt rf insulators needed
  • Simple one-hole installation in chamber baseplate possible
  • Temperature range for standard puck styles is -20 deg. C to +120 deg. C
  • Modifications for high pressure operation and low particle generation available.