ELECTROGRIP SPECIAL CHUCK TYPES

Electrogrip designs and constructs chucks and support hardware to suit customer needs.

• Design variables include:
  • Substrate type, grip pressure, uniformity, and backfill requirements
  • Physical, chemical and vacuum environment
  • Rf power
  • Purity, particle transfer and lift mechanism specification
  • Chuck flatness
  • Baseplate limitations
  • Cycle timing

Below are shown some chuck models for wafer processing. Chucks are also available for

• Glass-gripping Flat Panel Display processing,
• Sapphire substrates,
• Metal foil inspection and machining, and
• UHV-rated ultraflat chucks and electronics for EUV and other lithography tools.