Electrostatic Chuck Product Design

The CP series permits the chuck puck to be removed and replaced

  • ... without breaking liquid thermal transfer fluid lines.

The puck mounts with metal-to-metal contact to the service base,

  • yielding high thermal conduction to the puck.

CP assembly with 200mm chuck puck on 200mm service base;

  • wafer lift motor drive at bottom. Guard ring removed for clarity ...

CP assembly with 200mm chuck puck on 200mm service base;

  • wafer lift motor drive at bottom. Guard ring removed for clarity ...

A similar CP200 chuck assembly, with guard ring

CP200 series pucks for differing wafer sizes ...

  • The ceramic composition controls chuck surface appearance.
  • High-capacity replaceable Chuck Pucks for a wide range of application

For great solutions and experienced support ...

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