Electrostatic Chuck Product Design
The CP series permits the chuck puck to be removed and replaced
- ... without breaking liquid thermal transfer fluid lines.
The puck mounts with metal-to-metal contact to the service base,
- yielding high thermal conduction to the puck.
CP assembly with 200mm chuck puck on 200mm service base;
- wafer lift motor drive at bottom. Guard ring removed for clarity ...
CP assembly with 200mm chuck puck on 200mm service base;
- wafer lift motor drive at bottom. Guard ring removed for clarity ...
A similar CP200 chuck assembly, with guard ring
CP200 series pucks for differing wafer sizes ...
- The ceramic composition controls chuck surface appearance.
- High-capacity replaceable Chuck Pucks for a wide range of application
