Glass Semiconductor Wafer

Electrogrip's glass-gripping technology holds non-conductive materials such as

  • glass,
  • ceramic,
  • sapphire, and
  • quartz.

Electrogrip is able to grip through one substrate to grip a second masking substrate.

A mixture of multipolar and interdigitated chuck constructions yields high reliability.

CP style chuck performance gripping a thick sapphire wafer is shown below.

A typical 10 Torr backpressure yields 0.5sccm He leakage,

  • with a 'popoff' pressure of more than 40 Torr.

A further example of LCD glass-gripping chucks is shown in ourĀ other pages.

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