Glass Semiconductor Wafer
Electrogrip's glass-gripping technology holds non-conductive materials such as
- sapphire, and
Electrogrip is able to grip through one substrate to grip a second masking substrate.
A mixture of multipolar and interdigitated chuck constructions yields high reliability.
CP style chuck performance gripping a thick sapphire wafer is shown below.
A typical 10 Torr backpressure yields 0.5sccm He leakage,
- with a 'popoff' pressure of more than 40 Torr.
A further example of LCD glass-gripping chucks is shown in our other pages.